Disco
DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper
What it is
How it works
General reference — not yet source-verifiedA wafer grinder removes material from a wafer surface by controlled abrasive action.
A lapper and polisher use planarizing contact to reduce thickness variation and improve surface finish.
Where it fits in the process flow
General reference — not yet source-verifiedThe machine operates before later assembly or downstream wafer processing steps that require a flatter or thinner substrate.
Applications
What do the numbers mean?
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the model designation of this equipment?
The equipment is a Disco DFG 8760 / DFM 2700 In-Line Wafer Grinder / Lapper / Polisher.[2][1]
What are the configuration details of the DFG 8760 unit?
The DFG 8760 is a 3 Axis Dry Polishing Type 2 machine, with Z1 and Z2 grinding spindles and a Z3 polishing spindle.[1]
Not publicly documented
The following facts about the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment inventory listing
Last updated Oct 9, 2026.
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