Disco
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The Disco DGP 8761 is a semiconductor polishing machine.[1]
Wafer polishing equipment generally works by pressing a wafer against a rotating polishing interface while controlling motion, pressure, slurry delivery, and temperature. The process removes a small amount of material and improves surface planarity and finish.
The DGP 8761 sits in a wafer finishing flow where polishing follows prior shaping or thinning steps and precedes later assembly or inspection steps. The machine class supports surface refinement after material removal operations.
The DGP 8761 is used for semiconductor wafer polishing.[1]
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The Disco DGP 8761 is a polisher.[1]
The following facts about the DGP 8761 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DGP 8761 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DGP 8761 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DGP 8761 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DGP 8761 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DGP 8761 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 3, 2026.
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