EV Group
6200 NT
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The EVG 6200 NT is a mask alignment system. The EVG 6200 NT supports wafer or substrate sizes up to 200 mm. The EVG 6200 NT includes bond alignment, IR alignment, and SmartNIL capability.[1][2]
How it works
The EVG 6200 NT supports multiple exposure modes: vacuum contact, hard contact, soft contact, proximity mode, and flex mode. The system uses a mercury lamp or UV-LED light source. Wedge compensation is fully automatic and software-controlled. Alignment capabilities include manual alignment, automatic alignment, dynamic alignment, and edge alignment. The system supports top-side alignment, bottom-side alignment, IR alignment, bond alignment, and nanoimprint lithography (NIL) alignment.[1][5][6]
Applications
Applications include optical double-side lithography, nanoimprint lithography (NIL) via EVG's proprietary SmartNIL technology, bond alignment, and IR alignment. The system supports processing of materials such as silicon, gallium arsenide, silicon carbide, gallium nitride, glass, and flexible polymers.[1][2][5]
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
Wafer handling1
Optics & imaging3
Performance3
Control & software1
Configuration & options5
- Semi-automated or automated[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EVG6200 NT Gen2 | — | — | Fully-housed variant mentioned alongside semi-automated and automated configurations. | evgroup.com[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the EVG 6200 NT support?
The EVG 6200 NT supports substrates from pieces up to 200 mm / 8 inches.[1][5][6]
What alignment accuracies does the system achieve?
Top-side alignment accuracy is ≤ ±0.5 µm, bottom-side alignment ≤ ±1.0 µm, IR alignment ≤ ±2.0 µm (substrate dependent), bond alignment ≤ ±2.0 µm, and SmartNIL alignment ≤ ±3.0 µm.[1][5][6]
What exposure modes are available?
Exposure modes include vacuum contact, hard contact, soft contact, proximity mode, and flex mode.[1][5][6]
Not publicly documented
The following facts about the 6200 NT are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6200 NT are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 6200 NT are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6200 NT are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6200 NT is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 6200 NT are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]evgroup.com — evgroup.comevgroup.com
- [2]evgroup.com — evgroup.comevgroup.com
- [3]Inventory photo
- [4]Equipment inventory listing
- [5]instrumenthive.com — instrumenthive.cominstrumenthive.com
- [6]http://www.depart.com.cn/UploadFile/file/20250117/2025011717400702702.pdf — depart.com.cndepart.com.cn
Last updated Oct 3, 2026.
Compare with similar tools
View all →Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
