EV Group

The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.

The EVG 850 LT is an 8-inch bonder with wafer ID reader, prebond, IR inspection, plasma activation, and automated handling features.

The EVG 6200 NT is a semi automated bottom side alignment system with double-side operation and manual handling.

The EVG 150 is a modular cluster tool for coating and development of i-line photoresists.

The EVG EV 640 is a mask aligner for 6- and 8-inch wafers.

The EVG 301 is a semi-automated single wafer cleaning system for R&D, featuring megasonic cleaning, spinner rotation up to 3000 rpm, and optional pre-bonding and IR-inspection modules.

The EVG 850 TB Temporary Wafer Bonder is a tool for temporary wafer bonding, supporting 6-inch wafers.

The EV Group EV 501 is a wafer bonder that performs anodic bonding, used to seal Pyrex wafers to silicon microfluidic channels.

The EVG 6200 Mask Aligner is a lithography tool configured for 6-inch and 8-inch wafers.

The EVG 6200 NT is a mask alignment system for optical double-side lithography and wafer sizes up to 200 mm.

The EVG 420 Mask Aligner is a 6-inch wafer aligner that can only align wafers and has no exposure optics.

The EV Group EV 501 Wafer is a packaging and bonding tool for thermo compression, fusion, or anodic wafer bonding.

The EV Group 40 NT Measurement is a measurement system.

The EVG 6200 NT is a mask alignment system for optical lithography with wafer sizes up to 200 mm.

The EVG Wafer Bonder is a wafer bonding tool from EV Group.

The EVG IQA 0049 is a mask aligner from EV Group, with a vintage of 2012.

The EVG 850 is a direct bonding system for 6-inch wafers.

The EVG Hercules NIL is a 12-inch UV-NIL (Ultraviolet Nanoimprint) track system used for nanoimprint lithography.

The EVG®620 BA is an automated bond alignment system for wafer-to-wafer alignment for research and pilot production.

The EV Group 810 is a plasma activation tool used for cleaning and surface preparation.

The EV Group 520 HE Wafer is a wafer bonder for semiconductor packaging and bonding.

The EVG 301 Cleaning System is a manual wafer loading cleaning system with a camera for bond void inspection.

The EVG 150 Coater is a spin-on and spray-on coating system with chemistry cabinet, EBR/BSR, multiple pumps, two stations, and heated/chilled plates.

The EV Group 40 NT is an automated measurement system for metrology applications in semiconductor manufacturing, especially lithography and bonding.

The EVG 101 Spray Coater is a semi-automatic wafer spray coating system configured for 2-inch to 4-inch wafers.

EVG IQA 0048 Mask Aligner is a lithography mask aligner from EV Group.

The EVG 850 is a wafer bonding system from EV Group supporting wafer sizes from 2 to 12 inches.

The GEMINI is a state-of-the-art, fully automated production wafer bonding system that integrates wafer-to-wafer alignment and bonding processes in a modular design.

The EV Group 120 Automated Coater Processing System is an automated coater for 6-inch and 8-inch wafers, built in 2015 and requiring 50/60 Hz, 3-phase, 4-wire plus ground power.

The EVG 520 Wafer Bonder is a wafer bonding tool from EV Group.

EVG40 is an EV Group top-to-bottom side alignment accuracy measurement inspection system for non-destructive measurement of repeatable alignment accuracy.

EVG 120 is an automated resist processing system for coating and developing photoresist materials. EVG 120 supports wafers up to 200 mm and includes spin coating, spray coating, developing, bake/chill units, and wafer edge exposure.

The EV Group 850 LT SOI Fusion Wafer Bonder is a fully automatic wafer bonder configured for 8-inch/200mm wafers.

The EVG 520 is a manual wafer load substrate bonder with fusion, thermal compression, and anodic bonding capability.

The EVG 540 is a semi-automatic bonder with anodic, fusion, and adhesive bonding capability.

The EVG 850 SOI Wafer Bonder is a fully automatic wafer bonder suitable for wafer sizes up to 6 inch/150mm and currently configured for 6 inch/150mm wafers.

The EV Group 850 Debonder is a packaging and bonding tool for debonding temporary-bonded wafer stacks and cleaning separated wafers.

The EVG 520 IS Wafer is a manual wafer load substrate bonder with capabilities for fusion compression, thermal compression, and optional anodic bonding.

The EVG Gemini Automated Production Wafer Bonder is a wafer bonder with face-to-face alignment and automation features, supporting wafers up to 8"/200mm.

The EVG EV-420 is a front and backside contact mask aligner used for UV exposure in lithography.

The EVG Gemini Automated Production Fusion Bonder is a 300mm bonding system with automated handling, recipe programming, and alignment capabilities.

The EVG 501 Wafer Bonder is a manual wafer-load substrate bonder for 2-inch to 6-inch wafers.

The EV Group Gemini Vacuum is a packaging and bonding tool.

The EVG IQ Mask Aligner is a vintage lithography system described as capable of 6-inch or 8-inch wafers.

The EV Group 850 TBL is an automated bonding system with Laminator.

The EV Group 520IS is a wafer bonder used for backend processes and packaging.

EV Group 810LT is a low temperature plasma activation system with 3 process gases, manual wafer loading/unloading, and automated chamber closing/opening.

The EV Group 310 is a single-wafer cleaner with a megasonic DI water cleaning module and a pre-bond station with infrared lamp imaging.