Multitest
The Multitest MT 9510 XP is a Pick&Place handler designed for tri-temp testing of semiconductor packages. The Multitest MT 9510 XP uses standard Plunge-to-Board contacting and delivers industry-leading temperature accuracy without modifications.[1]

The Multitest MT 9510 XP is a Pick-and-Place handler for semiconductor final test. The MT 9510 XP is designed for tri-temp (hot, ambient, cold) testing of integrated circuits. The machine provides tri-temp handling capability with a temperature range that includes hot and cold testing. The MT 9510 XP is a model that supports ambient, hot, and cold (three-temperature) operation. Some units include a 3MTM (three-temperature) configuration. Some units are configured with an IEEE 488.2 interface and an ionizer kit. Some units include an RGB sensor for the 3MTM system. The MT 9510 XP is a handler model that can be equipped with conversion kits for specific package types such as QFP (Quad Flat Package).[5][2][3][6][1]
A Pick-and-Place handler moves individual devices from input trays or tubes to a test socket, where the tester contacts the device leads, and then sorts the devices into output bins based on test results. The MT 9510 XP uses a standard Plunge-to-Board contacting method for making electrical connections to the device under test. The temperature accuracy of the handler is measured directly on the device under test (DUT). The machine can maintain temperature accuracy for medium to long test times without requiring additional changes or add-ons. The MT 9510 XP can be configured with a quad-site contact unit holder for multi-site testing. The contact unit can support short contacts and tri-temp operation with hot air purge.[1][3]
Documented failure modes, common issues, and field considerations.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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Test and probe systems can handle a broad range of devices including logic ICs, memory chips, analog and mixed-signal circuits, RF components, MEMS sensors, and power devices. The specific test interface and instrumentation are configured according to the device type and test requirements.
A wafer prober contacts devices directly on the wafer using a probe card, allowing electrical tests before dicing. A package handler handles individual packaged devices, placing them into a test socket for final test after packaging. Both automate device handling and sorting but operate at different stages of the manufacturing flow.
Throughput depends on factors such as test time per device, contact and index time (mechanical movements), parallel test capability (number of sites tested simultaneously), and handling speed. System designers optimize these parameters based on the specific device and production volume requirements.
Typical test parameters include DC measurements (leakage current, supply voltage thresholds), AC parameters (timing, rise/fall times), functional logic patterns, analog signal integrity (gain, distortion), and parametric values (resistance, capacitance). The specific tests are defined by the device datasheet and test program.
The following facts about the MT 9510 XP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MT 9510 XP are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MT 9510 XP are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the MT 9510 XP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MT 9510 XP are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the MT 9510 XP are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Sep 29, 2026.
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The KLA 1007 is a wafer prober manufactured by KLA.