Oxford Instruments
NGP80
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
How it works
The PlasmaPro 80 RIE uses a graphite chuck with a temperature range of 5 to 80 degrees Celsius to control substrate temperature. The system employs electrode cooling to manage thermal load during etching.[4]
What do the numbers mean?
Power & electrical1
Vacuum & pumping3
Wafer handling6
Gas & chemistry2
Configuration & options7
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| NGP80 RIE | — | — | Dedicated reactive ion etch configuration with separate showerhead and matching network. | scribd.com[3] |
| NGP80 PECVD | — | — | Dedicated plasma-enhanced chemical vapor deposition configuration for uniform dielectric film deposition with selectable high/low frequency plasma power for stress control. | scribd.com[3] |
| NGP80 ICP | — | — | Inductively coupled plasma configuration with electrostatic shield for low damage, high rate etching. | scribd.com[3] |
| NGP80 RIE/PE | — | — | Combined RIE and plasma etch (PE) mode in a single system, combining anisotropy of RIE with selectivity of PE. | scribd.com[3] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the NGP80 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NGP80 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the NGP80 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NGP80 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NGP80 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the NGP80 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [2]instrumenthive.cominstrumenthive.com
- [3]scribd.com — scribd.comscribd.com
- [4]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [5]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Sep 26, 2026.
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