Semics
Opus 3 SH
The Semics Opus 3 SH is an automatic wafer probe system manufactured by Semics Inc. The Semics Opus 3 SH supports 6 inch, 8 inch, and 12 inch wafers. The Semics Opus 3 SH is part of the Semics Opus family of test and probe equipment.[1][2]
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe Opus 3 SH sits in wafer-level electrical test flow before die singulation and packaging.
The Opus 3 SH is used where wafers need probe contact for measurement, sorting, or device verification at the wafer stage.
Applications
The Opus 3 SH is used for wafer probe and test handling.[2][1]
The Opus 3 SH supports wafer sizes of 6 inches, 8 inches, and 12 inches.[1]
The Opus 3 SH has an accuracy of 1 µm, a probing force of 450 kgf, and an operating temperature range from -40 to 200 Degree C.[1]
The Opus 3 SH operates on 200~240 V at 50/60 Hz and has a full load current of 11 A, a max ampere rating of 25 A, and an interruption capacity of 10 kA.[4][2]
What do the numbers mean?
Power & electrical4
Wafer handling4
- 12 inch nickel hot chuck[4]
Performance1
Dimensions & facilities1
Configuration & options12
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| OPUS3 SLT | — | — | Other product from SEMICS Inc listed as a related wafer probe system. | semiconductor.directory[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is measured with this class of equipment?General reference — not yet source-verified
Machines of this class are used to measure electrical properties such as continuity, resistance, leakage, threshold behavior, and other parametric characteristics, depending on the test setup.
Why is probing needed instead of direct packaging test?General reference — not yet source-verified
Probing allows early electrical assessment of devices while they are still on the wafer or substrate, which supports screening, diagnosis, and process control before additional value is added.
Not publicly documented
The following facts about the Opus 3 SH are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Opus 3 SH are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Opus 3 SH are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Opus 3 SH are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Opus 3 SH is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Opus 3 SH are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]semiconductor.directory — semiconductor.directorysemiconductor.directory
- [2]Opus 3 SH — Semics | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]Inventory photo
- [4]Inventory photo
Last updated Oct 10, 2026.
