SUSS MicroTec
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS MicroTec AS8 / 12 is a manual coating and developing system for wafers up to 300 mm. The AS8 / 12 is specified for spray coating.[1]
Process applications and technology nodes documented for this tool.
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The following facts about the AS8 / 12 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AS8 / 12 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AS8 / 12 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AS8 / 12 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AS8 / 12 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AS8 / 12 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 22, 2026.
The ACS300 Gen3 is an automated coating and developing system for wafers up to 300 mm.
The SUSS MicroTec AD12 is a manual system for aqueous developing and wafer cleaning, handling wafers up to 300 mm.
The SUSS MicroTec ELP300 Gen2 is an automated excimer laser processing system for substrates up to 300 mm, used for ablation, laser-assisted debonding, and seed layer removal.