SUSS MicroTec
XB8
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS MicroTec XB8 is a semi-automated wafer bonding system. The XB8 handles wafers up to 200 mm. The XB8 performs high-force wafer bonding.[1]
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What it is
How it works
General reference — not yet source-verifiedWafer bonders join two or more wafers by applying pressure and heat to activate bonding layers. The bonding process can use adhesive, fusion, eutectic, or metal diffusion methods. Some bonders include plasma activation to improve adhesion before bonding.
What can it run?
Process applications and technology nodes documented for this tool.
- High-Force Wafer Bonding
What do the numbers mean?
Wafer handling2
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of system is the SUSS MicroTec XB8?
The XB8 is a semi-automated wafer bonding system.[1]
Not publicly documented
The following facts about the XB8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the XB8 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the XB8 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the XB8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the XB8 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the XB8 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]hilpert.ch — hilpert.chhilpert.ch
Last updated Sep 22, 2026.
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