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Teradyne

Nextest Magnum II EV ICP Memory

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Nextest Magnum II EV ICP Memory — Inventory photo
Fig. 01Nextest Magnum II EV ICP MemoryInventory photo[1]

What it is

The Teradyne Nextest Magnum II EV ICP Memory is a Test & Probe equipment model.[1][2]

How it works

General reference — not yet source-verified

Test and probe equipment is used to make electrical contact to devices on a wafer and evaluate them before later assembly steps.

Probe-based test equipment is part of the semiconductor test flow and supports device characterization, screening, and pass or fail sorting at the wafer stage.

Where it fits in the process flow

The Teradyne Nextest Magnum II EV ICP Memory belongs in the wafer-stage test and probe portion of semiconductor manufacturing.[2]

Applications

General reference — not yet source-verified

Probe-stage memory test equipment is used to evaluate semiconductor memory devices before further manufacturing steps.

What do the numbers mean?

No specifications recorded yet

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What category does the Teradyne Nextest Magnum II EV ICP Memory belong to?

The equipment belongs to the Test & Probe category.[2]

What is the model name?

The model name is Magnum II EV ICP.[1]

Not publicly documented

The following facts about the Nextest Magnum II EV ICP Memory are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No specifications for the Nextest Magnum II EV ICP Memory are on record.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Nextest Magnum II EV ICP Memory are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Nextest Magnum II EV ICP Memory are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Nextest Magnum II EV ICP Memory are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Nextest Magnum II EV ICP Memory are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Nextest Magnum II EV ICP Memory — Teradyne | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 9, 2026.

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