Fab Operation
Labs, QA, characterization
Failure-analysis and metrology labs: cross-sectioning, imaging, electrical fault isolation, and materials characterization.
Metrology & Inspection
Optical first, SEM second — most labs pair the two
The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.
Test & Probe
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.
The Keysight MSOX 4154 A is a mixed signal oscilloscope with 1.5 GHz bandwidth, 5 GSa/s sampling rate, and 4 channels.
Keysight / Agilent M 9037 A is a PXIe embedded controller.
Dicing & Grinding
Cross-section prep pairs polishing with the imaging queue
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.
The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.
The Accretech ACS 100 A is a cleaning after dicer system used in semiconductor dicing and grinding operations.
The Disco DAD 3350 is an automatic dicing saw.
The Disco DAG810 is a compact automatic surface grinder used for thinning silicon, III/V materials, glass types, wafers, stacked wafers, and chips.
Wet Processing / Clean
The Glen/YES 1000FP is a plasma cleaning system designed to accept a range of shelf sizes for changing flat panel industry needs.
The Ultratech 602 Plate Mask Cleaner is a cleaning tool designed for masks and plates in semiconductor manufacturing.
Precision Optics
The Wyko HD8000 is a non-contact optical profiler for magnetic thin-film heads that measures pole-tip recession or ABS flatness in less than 3 seconds.
The Wyko NT1100 is an optical profiler in the Wyko optical profiler product line.
The SCIEX API 2000 is a compact triple-quadrupole LC/MS/MS system introduced in 1998.
The Zygo Zegage 3D Optical Surface Profiler is a non-contact optical profiler for measuring surface topography.
The JDSU HA9W2 is a fiber optic equipment model from JDSU, a manufacturer known for optical communications products.
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