Accretech
SS 20 Automatic Dicing alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Disco
DAD 3350 Automatic Dicing
Dicing & Grinding
The Disco DAD 3350 is an automatic dicing saw.
Disco
DAD 340 Wafer
Dicing & Grinding
The Disco DAD 340 Wafer is a wafer dicing saw used in semiconductor back-end processing.
Disco
DFD 6341
Dicing & Grinding
The Disco DFD 6341 is a dicer identified with 3-phase, 380-415 V, 3 wire + ground, 50/60 Hz power requirements.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
Blanchard
20 36 Surface
Dicing & Grinding
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
Compare interactively
Need a side-by-side spec table? Open the compare tool to pick any two models.
Compare SS 20 Automatic Dicing with another model →