Strasbaugh
7 AF Back alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Disco
DAD 340 Wafer
Dicing & Grinding
The Disco DAD 340 Wafer is a wafer dicing saw used in semiconductor back-end processing.
Disco
DAG 810 Back
Dicing & Grinding
The Disco DAG 810 is a back grinder used for semiconductor wafer processing.
Disco
DTG 8460 Taiko
Dicing & Grinding
The Disco DTG 8460 Taiko Grinder is a cassette-to-cassette grinder configured for 12-inch wafers.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
Blanchard
20 36 Surface
Dicing & Grinding
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
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