Waferpedia

Laurell

WS-650-23

Spin coater150mmLaurell WS-650-23 family
Research Quality: 60% complete
WS-650-23 — web.archive.org
Fig. 01WS-650-23web.archive.org[1]

Wafer size

150mm

Power

95 to 240VAC, 47/63HZ, ~300 Watts[1]

Gas delivery

N₂ at 60–70 PSIG (4–5 bar)[1]

What it is

The Laurell WS-650-23 is a station-mounted spin coater in the WS-650 series. The WS-650-23 model accommodates wafers up to 150 mm and substrates up to 5 inch by 5 inch.[1]

How it works

The WS-650-23 uses a process controller with microprocessor-based control and accompanying PC software. The controller allows real-time operator interaction during a run, including pausing, stopping, and continuing the process.[1]

The WS-650-23 uses vacuum chucks and wafer alignment tools to center wafers on the chuck. The system uses a closed bowl, a labyrinth seal, and nitrogen purge to reduce chemical contamination of the motor and control electronics.[1]

Where it fits in the process flow

The WS-650-23 is used for coating, etching, developing, rinsing-drying, and cleaning. The WS-650-23 is suited to solvent-based, base-based, and acid-based processing.[1]

Applications

The WS-650 series is used with many dispense options, including manual and automatic dispense. The WS-650-23 supports processes involving photoresist, developer, SC-1, and SC-2 chemistries, although the model guidance recommends single-use processing to avoid cross-contamination.[1]

The WS-650-23 can be fitted with removable chamber liners and an optional PTFE housing. The model also offers in-deck mounting and on-deck mounting configurations.[1]

  • Solvent, base, or acid-based processing
  • Coating
  • Etching
  • Developing
  • Rinsing-drying
  • Cleaning
  • MEMS spray coating development

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Laurell recommends single-use only due to known material conflicts.
  • Photoresist and developer can cause cross-contamination.
  • SC-1 and SC-2 create NH4Cl, described as a hazardous inhalation risk.

What do the numbers mean?

Power & electrical1

Power
95 to 240VAC, 47/63HZ, ~300 Watts[1]
Accurate?

Vacuum & pumping2

Vacuum
25–28 inches Hg; suggested flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[1]
Accurate?
Vacuum requirement
25–28 inches Hg (~635–711 mm Hg) with a flow volume of 4.5 SCFM (0.127 m³/min) at 0 inches Hg[1]
Accurate?

Wafer handling4

Wafer capacity
Up to ø 150 mm wafers[1]
Accurate?
Substrate capacity
5" × 5" (127 mm × 127 mm) substrates[1]
Accurate?
Maximum rotational speed
12,000 RPM (based on a ø 100 mm silicon wafer)[1]
Accurate?
Maximum substrate size
150 mm wafers, 5" × 5" (127 mm × 127 mm) substrates[1]
Accurate?

Gas & chemistry3

Seal/process purge gas
N₂ at 60–70 PSIG (4–5 bar)[1]
Accurate?
Gas consumption (standard motor)
3 cubic feet per hour (0.085 m³/hour)[1]
Accurate?
Gas consumption (high-performance motor)
20 cubic feet per hour (0.566 m³/hour)[1]
Accurate?

Dimensions & facilities1

Required N2 process/seal purge
60–70 PSIG (4–5 bar) of Nitrogen/CDA[1]
Accurate?

Configuration & options3

Model
WS-650-23 B Spin Coater[1]
Accurate?
Mounting
Station Mounted[1]
Accurate?
Processes supported
Coating, Etching, Developing, Rinsing-Drying and Cleaning[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
WS-650-23 B———web.archive.org[1]
WS-650-23B———web.archive.org[2]
Interested in this tool?
Need help with this tool?Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Power95 to 240VAC, 47/63HZ, ~300 Watts[1]
  • Vacuum25–28 inches Hg; suggested flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[1]
  • Vacuum requirement25–28 inches Hg (~635–711 mm Hg) with a flow volume of 4.5 SCFM (0.127 m³/min) at 0 inches Hg[1]
  • Seal/process purge gasN₂ at 60–70 PSIG (4–5 bar)[1]
  • Gas consumption (standard motor)3 cubic feet per hour (0.085 m³/hour)[1]
  • Gas consumption (high-performance motor)20 cubic feet per hour (0.566 m³/hour)[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What substrate sizes does the WS-650-23 accept?

The WS-650-23 accommodates wafers up to 150 mm and substrates up to 5 inch by 5 inch.[1]

What is the maximum rotational speed of the WS-650-23?

The WS-650-23 has a maximum rotational speed of 12,000 RPM based on a 100 mm silicon wafer.[1]

What processes is the WS-650-23 used for?

The WS-650-23 is used for coating, etching, developing, rinsing-drying, and cleaning.[1]

What utilities does the WS-650-23 require?

The WS-650-23 requires nitrogen or clean dry air for process and seal purge, vacuum, and electrical power from 95 to 240 VAC at 47/63 Hz.[1]

Not publicly documented

The following facts about the WS-650-23 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the WS-650-23 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the WS-650-23 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the WS-650-23 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the WS-650-23 are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the WS-650-23 are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
Was this page accurate?

Last updated Oct 5, 2026.

Compare with similar tools

View all →