Fab Operation
Image sensors, detectors, arrays
Image-sensor and detector processing: pixel patterning, color/microlens layers, backside processing, and array test.
Spin coater
Color filter and microlens coats
The Laurell EDC-HL-15 B is a 650-series EDC spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.
The Laurell Lz-23 B is a compact 650-series spin coater that accommodates up to 150 mm wafers and 5 in × 5 in substrates.
The Laurell EDC-HL-23 B is a compact EDC spin processor with capacity for up to 150 mm wafers and 5 in x 5 in substrates.
The Laurell H6-23 is a compact HL Series spin coater for wafers and substrates, with a maximum rotational speed of 12,000 RPM.
The Laurell WS-650-8B is a compact 650-series spin coater with a maximum rotational speed of 12,000 RPM and support for wafers up to 200 mm.
Lithography
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
The KLA FT-750 is a visible light spectrophotometer-based thin film measurement system for semiconductor process control.
The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.
The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.
Etch
The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.
The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.
Lam Research A 6 Exelan HPT is a dielectric etch tool configured for 8-inch wafers and identified with Exelan HPT chambers.
The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.
The Oxford NGP80 RIE is a plasma etch system located in room W1-062.
Deposition
The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
The Denton Explorer 14 RF Sputterer is an RF sputterer manufactured by Denton Vacuum.
The Lam / Novellus / Gasonics Triple Speed NF is a chemical vapor deposition (CVD) system with three HDP chambers, a Brooks robot, SLM type, three ports, and loadlock helium reduction.
The Applied Materials Producer III is a chemical vapor deposition (CVD) system.
Dicing & Grinding
BSI flows pair grinding with bonding to a carrier
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.
The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.
The Accretech ACS 100 A is a cleaning after dicer system used in semiconductor dicing and grinding operations.
The Disco DAD 3350 is an automatic dicing saw.
The Disco DAG810 is a compact automatic surface grinder used for thinning silicon, III/V materials, glass types, wafers, stacked wafers, and chips.
Packaging & Bonding
MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.
The Wyko SP3200 is a gauge-capable advanced packaging profiling system for in-line process monitoring of flip-chip packaging.
The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.
The West Bond K 1200 P is a semiconductor manufacturing equipment unit cataloged under asset number 136359.
The SUSS SB 6 E is a semi-automatic substrate bonder designed for aligned and unaligned wafer, substrate, and chip bonding using thermo-compression, anodic, fusion, adhesive, and related technologies.
Test & Probe
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.
The Keysight MSOX 4154 A is a mixed signal oscilloscope with 1.5 GHz bandwidth, 5 GSa/s sampling rate, and 4 channels.
Keysight / Agilent M 9037 A is a PXIe embedded controller.
Metrology & Inspection
The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.
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